Blog

Imaging Internal MEMS Structures Using Infrared Reflection Microscopy

Application note | Explore a practical example of non-destructive MEMS analysis for failure analysis, process development, and device characterization, powered by Jay Photonics' infrared reflection technology.

Full-wafer infrared inspection for detecting bonding voids in silicon wafers

Application note | Improved resolution and defect visibility for bonding void inspection across full silicon wafers using Jay Photonics' technology.

Imaging Through Thin Chromium Films Using IR Transmission Microscopy

Application note | Although thin chromium layers are often considered incompatible with transmission-based optical inspection, this work evaluates the practical feasibility and limitations of inspecting underlying structures using Jay Photonics' technology.

Imaging Photonic Grating Couplers Through Silicon

Application note | See how grating couplers and waveguides buried in silicon can be imaged through 1 mm of Si, with side-by-side IR microscope comparisons.

Imaging Through Germanium: Unlocking High Resolution

Application note | See through 20 µm of Germanium to reveal internal device features, from junctions to complex interconnects, opening new possibilities for R&D and device characterization.

Silicon Verniers: Sharper Visualization Using Optimized Infrared Microscopy

Application note | Visualize embedded silicon Verniers with unmatched clarity using Jay Photonics' infrared transmission microscopy. Achieve sub-micron alignment precision.