Frequently Asked Questions

We get a lot of very good questions about our systems. Here are the most common ones.

If you’re wondering about something specific, just reach out!

What the technology can and cannot do 

What materials can be inspected? 

Our technology is optimized for silicon (Si) but it is also compatible with:

  • Germanium (Ge) (see app note)
  • Silicon Carbide (SiC)
  • Gallium Arsenide (GaAs)
  • Indium Phosphide (InP)
  • InGaAs and other III–V compounds
  • SOI (Silicon-on-Insulator)

Thin metal layers can also be compatible depending on thickness and continuity, including:

If your material isn’t listed here, don’t assume it won’t work. Send us the stack details or a representative sample, we’re happy to take a look and give you a clear answer.

What types of structures can be observed?

The technology is commonly used for non-destructive inspection of:

  • Alignment marks
  • Bonding interfaces
  • Bonding defects (voids, bubbles)
  • Nanometric buried structures
  • Cracks
  • Delamination
  • Through-Silicon Vias (TSVs)
  • Micro-bumps and hybrid bonding interconnects
  • MEMS structures, release status, and dynamic operation through silicon

You can explore real examples in our application notes.

👉 Have a specific structure in mind? Send us an image or stack description, we’ll tell you honestly whether it’s a good fit.

Can the technology inspect packaged devices?

It depends on the package material.

Devices fully enclosed in thick metal cannot be inspected unfortunately. If one side is removed, inspection is possible with a dedicated add-on configuration (our proprietary darkfield reflection mode) on our modular platform.

Plastic or other infrared-transmissive packages can often work, provided thickness and material properties allow sufficient transmission.

The easiest way to know for sure is to test it.

Can the technology inspect devices mounted on PCBs?

The Si-Through-HR ready-to-buy benchtop microscope is not designed for PCB-level inspection.

However, PCB inspection is possible with a dedicated add-on configuration (our proprietary darkfield reflection mode) on our modular platform.

What matters is whether the silicon region of interest remains optically accessible through the board and assembly.

How deep inside silicon or semiconductor materials can you inspect?

Inspection depth depends on the material and stack composition.

In silicon, the system can image through multiple millimeters of stacked material. We have also successfully tested transmission through 50 um of germanium and up to 250 nm of chrome.

What the technology is (and is not)

Is your inspection method destructive?

No. The inspection is fully non-destructive.

No cross-sectioning, thinning, or physical modification is required. Your samples remain intact and reusable for further analysis.

Is your technology based on a laser or an LED?

The technology uses an infrared LED, not a laser.

This means:

  • Speckle-free imaging with no interference artifacts
  • No laser classification constraints
  • No special laser safety procedures
  • Stable and repeatable illumination

In other words: powerful, yet simple to use.

Is your technology essentially just a camera?

No.

Our patent-pending technology is based on a proprietary infrared camera and light source with a unique spectrum that, when paired, provide exceptional resolution — reaching submicron levels with a 100× objective. The spectrum has the advantage of bypassing optical aberrations, allowing the technology to be compatible with virtually all objectives operating in the visible, NIR, and SWIR ranges, enabling easy and direct integration into almost any existing inspection system or production line.

Other frequently asked questions

How can I confirm whether the technology will work for my specific use case?

The best way to confirm compatibility is to review your material stack and device configuration together.

We typically start by discussing your use case, including materials, layer structure, metal content, packaging, and the features you want to observe. Based on that, we’ll let you know whether evaluation makes sense.

If it does, we’ll image your device during a live virtual demo so you can see the results in real time.

👉 Send us a short description of your structure or application, and we’ll guide you through the next steps.

Does the microscope come with a software?

Yes. The system includes intuitive software that provides basic parameter controls such as exposure time and gain, and allows users to capture and save images. It also supports simple measurement functions.

Since the camera is USB-based, the microscopes are also compatible with most third-party software that supports standard USB cameras.

Is the system compatible with different sample sizes and formats?

The Si-Through-HR ready-to-buy microscope is primarily designed for dies. It can supports wafers up to 4 inches with an add-on insert.

Our modular version accommodates wafers up to 8 inches, and custom configurations can support up to 12 inches when required.