How It Works
No cutting. No sample prep. In real time.
The Si-Through-HR is an infrared microscope built specifically for subsurface inspection of silicon and other semiconductor materials. This page explains how it works, what it can image, and whether it fits your application.
Does any of this sound familiar?
You need to see what's happening inside your device — not just on the surface.
- Your process involves stacked, bonded, or heterogeneous materials, and critical defects may be buried within the stack.
- Cutting or polishing the sample destroys the very thing you're trying to inspect.
- You've looked at existing IR microscopes. They cost $100K+ and may still lack the resolution you need.
- You're not sure anything on the market works for your specific substrate or geometry.
- You've considered building your own setup, but the optical expertise isn't in-house.
If you checked one or more of these, you're in the right place!
How Infrared Inspection Works: From Sample to Results
Step 1 — Tell us about your application
Substrate material, layer stack, what you're trying to see. A short email or a 20-minute call is enough for us to tell you if it's feasible.
Step 2 — We image your samples
You ship us your samples. We image them using our infrared imaging system and show you the results live on a 15-minute video call. You see real data from your actual device, before you commit to anything.
Step 3 — You decide
If the imaging works for your application, we discuss configurations and pricing.
No pressure, no lengthy sales cycle.
Compatible Semiconductor Materials: What the Si-Through-HR Can Image
Several semiconductor materials become partially transparent at infrared wavelengths, enabling non-destructive imaging of buried structures.
The table below lists the materials we have tested and validated on the Si-Through-HR, along with typical use cases and known limitations.
| Material | Typical Applications | Limitations |
|---|---|---|
| Silicon | Data center transceivers, On-chip photonic routing, Passive waveguides, MEMS | No limitations * |
| Silicon Nitride (SiN) | Low-loss photonic routing, LiDAR, Biosensing, Frequency combs | Thin films require suitable substrate and stack design. |
| Indium Phosphide (InP) | Integrated lasers and detectors, Telecom transceivers, Coherent systems | Imaging depends on substrate thickness and fabrication. |
| Germanium (Ge) | Infrared Photodetectors, High-speed electronics, Semiconductor substrates | Performance depends on thickness. |
| Chrome (Thin Films) | Photomasks, alignment marks, electrodes | Imaging is limited by film thickness and coverage. |
* Without aberration-correcting optics, image sharpness decreases with imaging depth, as it does with all materials. Performance may also decrease in extremely heavily doped silicon. Good imaging performance has been demonstrated in highly doped silicon with resistivity as low as 10 mΩ·cm.
Not seeing your material?
IR Microscopy Image Quality: Si-Through-HR vs. Existing Systems
Same sample. Same magnification. Different technology.
The images on the left were captured with an existing IR microscope equipped with an InGaAs camera, costing $100,000+. The images on the right were captured with the Si-Through-HR microscope.
Image of an integrated silicon photonic chip sandwiched between two 500 µm thick silicon wafers.
The smallest demonstrated feature successfully resolved by the system is a silicon grating with 400 nm line widths.
Real Results : Non-Destructive IR Inspection for Bonding, Alignment, and Beyond
Every application is different. Here are a few examples of what we have explored.
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Alignment verniers
See full application noteLateral misalignment between stacked layers clearly identified.
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Bonding voids
See full application noteVoids and interface irregularities revealed in a single shot, with fine defects clearly visible.
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MEMS
See full application noteSubsurface mechanical structures revealed with clear structural detail at high magnifications.
Working on a similar challenge?
Si-Through-HR System Configurations for Semiconductor Inspection
All Si-Through-HR systems use Jay Photonics’ proprietary infrared imaging technology.
The right configuration depends on your sample size, format, and inspection needs.
| Your application | Sample format | Imaging approach | Recommended system |
|---|---|---|---|
| Inspecting bare dies and small silicon samples | Small samples with optical access from both sides and at least one polished surface | Transmission | Compact Si-Through-HR |
| Inspecting mounted or packaged dies | Transmission through the sample is obstructed by the mounting/substrate | Reflection | Configurable Si-Through-HR |
| Inspecting full wafers | Supports 4″–8″ wafers and customizable for 12″ wafers | Transmission and/or reflection | Configurable Si-Through-HR |
| Applications requiring multiple imaging modes | Chips or wafers | Transmission and reflection | Configurable Si-Through-HR |
Available Add-ons
| Option | What it helps with | Compact Si-Through-HR | Configurable Si-Through-HR |
|---|---|---|---|
| Polarizers | Enable stress imaging through stress-induced birefringence. | Optional | Optional |
| Darkfield | Reveals hidden details that can be difficult to see with standard illumination, such as microcracks | Optional | Optional |
| Iris diaphragm | Controls the illumination aperture to optimize image contrast and depth of field | Optional | Included |
| Larger-sensor camera | Captures a larger area in a single image | — | Optional |
Pricing & Configurations
| Compact Si-Through-HR | Configurable Si-Through-HR |
|---|---|
|
|
| Ready-to-buy system for chip inspection | Configured for your sample and inspection requirements |
| Starting at $4,950 USD | Starting at $30,000 USD |
| View product → | Contact us → |
Not sure if it works for your samples?
The fastest way to find out is to show us what you're working with.
Tell us your substrate, your layer stack, and what you're trying to see. We'll take it from there.